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A special failure analysis process to save some de-caped recovered cases

机译:一个特殊的失败分析过程,以节省一些去封闭的恢复案件

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摘要

For some High power analog ICs, with a failure mode that some high side MOSFETs could not be turned on, they recovered after de-capsulation by fuming nitric acid, which resulted in the undetermined failure root cause. A hypothesis was proposed that there may be a foreign matter inducing gate short source in a high side MOSFET in the power die as there is no passivation covered the MOSFET. For confirming this hypothesis and avoiding recovering, a special failure analysis process was employed in a couple of cases. The hypothesis was confirmed and the failure mechanism was revealed thanks to this special failure analysis process.
机译:对于一些高功率模拟IC,具有失效模式,通过熏蒸硝酸脱胶后,它们可以在未打开后恢复,从而导致未确定的失效根本原因。提出了一个假设,即在电源管芯中的高侧MOSFET中可能存在异物诱导栅极短源,因为没有钝化MOSFET。为了确认这一假设和避免恢复,在几种情况下采用了特殊的故障分析过程。确认了假设,并且由于这种特殊故障分析过程,揭示了失败机制。

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