The Study of Injection Compression Molding of Thin-wall Light-guide Plates with Hemispherical Micro structures

摘要

Light-guide plate (LGP) is a key component of back-light modules in liquid crystal displays; warpage is one of the factors that affect the quality of LGP. Orthogonal simulation and experiment are used in this paper to study the effect of the injection compression molding (ICM) parameters, such as the melt temperature, injection speed, mold temperature, compression distance, and compression speed. Both the simulation and experiment show that the most important factor that affects the products' warpage is melt temperature. And the effect order of the parameters from the simulation analysis is melt temperature, injection speed, mold temperature, compression distance, compression speed, and the effect order from the experiment analysis is same to the simulation analysis. So the experiment results prove the simulation results.