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In-Vacuum Plasma Cleaning Sources of non-Electrically Conductive Substrates

机译:非导电基材的真空等离子体清洁源

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Non-electrically conductive substrates form a large part of the engineered coated products in the market place, such as glass panels, plastic decorative components, polymeric flexible webs, etc. Many of these substrates offer a low cost raw material, and require surface engineering in large production manufacturing processes in order to bring a cost effective functionality. Many of the vacuum coating technology processes involve coating of such non-electrically conductive materials. All functional coating require a minimum level of adhesion and that is typically achieved by substrate preparation before the functional coating gets deposited. In electrically conductive substrate the negative biasing of the substrates would enhance the ion cleaning of the substrate by increasing the bombardment efficiency of positive ions generated in the plasma over the negatively biased substrate. In non-electrically conductive substrates that bias is reduced to the self-bias which occurs as the elements are immersed in the vacuum plasma environment. Sometimes that level of bombardment is not sufficient in order to bring adequate cleaning and preparation of the substrate/coating interface and in most cases it cannot bring consistency of performance during the whole manufacturing campaign. For those cases then active cleaning methods are required. Plasma treater is a general term used for substrate cleaning, preparation and conditioner before a functional coating is being deposited over a substrate. Plasma Treaters are specially important when the substrate is electrically non-conductive. This presentation will explore the ways in which these plasma treaters are being used and some of the challenges ahead and aspects that would require a higher degree of control on plasma treatment processes.
机译:非导电基材在市场上形成了大部分工程化涂层产品,例如玻璃面板,塑料装饰部件,聚合物柔性纤维网等。许多这些基板提供低成本的原料,并要求表面工程大型生产制造工艺,以带来具有成本效益的功能。许多真空涂层技术过程涉及涂覆这种非导电材料。所有功能涂层都需要最小粘合水平,并且通常通过底物制剂在沉积的底物制备之前实现。在导电基板中,基板的负偏置将通过增加在带负偏置的基板上的等离子体中产生的正离子的轰击效率来增强基板的离子清洁。在非导电基板中,偏置被减小到作为元件浸入真空等离子体环境中而发生的自偏压。有时,这种轰炸水平是不够的,以便为基板/涂层界面提供足够的清洁和制备,并且在大多数情况下,它不能在整个制造活动期间带来性能的一致性。对于那些案例,则需要主动清洁方法。等离子体处理器是用于在沉积在基材上沉积功能涂层之前用于衬底清洁,制备和调节剂的一般术语。当基材是电不导电的时,等离子体治疗剂是特别重要的。本演示文稿将探讨正在使用这些等离子体治疗方法的方式以及需要更高的等离子体治疗过程的挑战和方面的挑战。

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