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Effect of Duty Cycle on Pulse Electrodeposited Tin Seleno Telluride Semiconductor Thin Film

机译:占空比对脉冲电沉积锡硒碲化物半导体薄膜的影响

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Tin seleno telluride thin film was deposited by pulse electrodeposition onto fluorine doped tin oxide coated glass from aqueous solution containing Sn-EDTA, Na_2SeO_3 and TeO_2. The sample was deposited at a potential of -0.40 V vs Ag/AgCl with various duty cycle between 10% to 90% followed by annealing under nitrogen gas at 250°C for 30 minutes. The crystalline structure, morphology and photoresponse of the thin film were analyzed using X-ray diffraction (XRD), scanning electron microscopy and linear sweep photovoltammetry techniques. The XRD pattern shows polycrystalline cubic structure of SnSe_(0.4)Te_(0.6) for film deposited at 50% duty cycle. The domain peak at 2θ=28.82° shows a high intensity and a better photoresponse due to the small crystalline size and better crystallinity. The tin seleno telluride thin film reflects the loose short rod type aggregates at 10% -50% duty cycle and dendritic structure was formed at deposition of 75% and above. The deposited tin seleno telluride is a p-type semicoductor and the band gap was found to be 1.60 eV with direct transition.
机译:通过脉冲电沉积在含有Sn-EDTA,NA_2SEO_3和TEO_2的水溶液中脉冲电沉积在氟掺杂型氧化锡涂覆的玻璃上沉积锡Seleno碲化酯薄膜。将样品沉积在-0.40VVs / AgCl的电位下,在10%至90%之间,随后在250℃下在氮气下退火30分钟。使用X射线衍射(XRD),扫描电子显微镜和线性扫描光伏电压技术分析薄膜的晶体结构,形态和光孔。 XRD图案显示了在50%占空比下沉积薄膜的SNSE_(0.4)TE_(0.6)的多晶立方结构。域峰值在2θ= 28.82°,显示出由于小的晶粒尺寸和更好的结晶度而导致的高强度和更好的光响应。锡硒蛋白碲化物薄膜反射松散的短杆型聚集体,在10%-50%-50%占空比下,在沉积中形成树枝状结构75%及以上。沉积的锡Seleno碲化物是p型半导体,并且发现带隙是1.60eV,直接过渡。

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