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Enhanced thermoelectric properties of Hf doped half-Heusler compound NbFeSb

机译:增强HF掺杂半口腔复合NBFESB的热电性能

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The structural, electronic and thermoelectric transport properties of NbFeSb and Nb_(0.75)Hf_(0.25)FeSb have been studied using full potential linearized augmented plane wave (FPLAPW) method as implemented in WIEN2k code and the Boltzmann transport equations. The calculated value of band gap of NbFeSb is 0.53 eV which agrees well with the available data. We have studied the variation of Seebeck coefficient, electrical conductivity, Power factor and electronic thermal conductivity with respect to temperature. The calculated value of electrical conductivity for NbFeSb at room temperature is 0.049×10~(19) Scm~(-1)sec~(-1) which increases to value 1.42×10~(20) Scm~(-1)sec~(-1) for Nb_(0.75)Hf_(0.25)FeSb. The value of Power factor for pure compound is 2.84×10~(11) WK~(-2)cm~(-1)sec~(-1) which also increases to value 3.02×10~(11) WK~(-2)cm~(-1)sec~(-1) for Nb_(0.75)Hf_(0.25)FeSb at room temperature. The increase in the value of power factor due to doping suggest that Hf doped NbFeSb can act as efficient thermoelectric material.
机译:已经研究了NBFESB和NB_(0.75)HF_(0.25)FESB的结构,电子和热电传输特性,该方法是在Wien2K码和Boltzmann传输方程中实现的全电位线性化的增强平面波(FPLAPW)方法。 NBFESB的带隙的计算值是0.53eV,它与可用数据一致。我们已经研究了塞贝克系数,导电性,功率因数和电子热导率的变化相对于温度。在室温下NBFESB的电导率的计算值为0.049×10〜(19)SCM〜(-1)SEC〜(-1),其增加到值1.42×10〜(20)SCM〜(-1)秒〜 (-1)对于NB_(0.75)HF_(0.25)FESB。纯化合物的功率因数值为2.84×10〜(11)WK〜(-2)cm〜(-1)秒〜(-1),也增加到值3.02×10〜(11)WK〜( - 2)CM〜(-1)SEC〜(-1)对于NB_(0.75)HF_(0.25)FESB在室温下。由于掺杂引起的功率因数值的增加表明,HF掺杂NBFESB可以作为高效的热电材料。

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