The very first Strain Range Bound Guidance methodology for system board shock evaluation

摘要

The wide varieties of system board designs and form factors in the market make electronic package mechanical shock assessments extremely complicated and challenging. The very first strain range guidance methodology presented in this paper attempts to simplify this. This methodology is achieved by establishing a safe limit for the package in both system and component level shock test environments, then integrating them into a single range guide. In this paper, details of both types of board level setups and test conditions are presented along with test results which include strain outputs, bend modes, strain states, together with conclusive failure analysis. For system boards, different board sizes, layouts, heat sinks are assessed and compared. The outcome is a simple strain guide that has been successfully demonstrated. Additionally, the scope of this paper also includes some key learning from the tests and impact of various design attributes on shock performance.