Study on Key Factors of Affecting Thermal Conductivity of Multi-Pore Ceramic Tiles Prepared by Ceramic Polished Waste

摘要

By using building ceramic polished wastes as main raw materials, mixing part clay and solvent substance, the multi-pore ceramics tiles were sintered under the firing temperature of 1453 ± 10 K and the key influencing factors on thermal conductivity of the multi-pore ceramic tiles are analyzed in this paper. The experimental results show that the multi-pore ceramic tiles possess closed pores whose average diameter is 0.3 mm, and that the density, rupture modulus, thermal conductivity and sound insulation factor of the multi-pore ceramics tiles are 4.6 g·cm~(-3) ～ 6.5 g·cm~(-3), 4.6 MPa ～ 12 MPa, 0.118 W·m~(-1)·K~(-1) ～ 0.405 W·m~(-1)·K~(-1) and 26 dB 32 dB, respectively. It is found that under sintering temperature of 1373 K, the thermal conductivity and bulk density of multi-pore ceramic tiles decrease with the increase of building ceramic polished waste content, and the rupture modulus increases with augmenting ceramic polished waste content. It is also found that under the same amount of building ceramic polished waste (60 wt %), the thermal conductivity, bulk density and rupture modulus decrease with the rising sintering temperature from 1443 K to 1463 K, and average diameter of pores and sound insulation factor of multi-pore ceramic tiles increase with the rising sintering temperature.