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Effect of surface treatments/coatings and soft bake profile on surfaceuniformity and adhesion of SU-8 on a glass substrate

机译:表面处理/涂层和软烘烤曲线对玻璃基板上SU-8的表面均匀性和粘附性的影响

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We present the effect of surface treatments/coatings and soft bake temperatures aimed at improving adhesion and surface uniformity of SU-8 on glass substrates. While the adhesion strength of SU-8 to metal layers on glass and silicon has been previously investigated, our research examines the influence of additional surface treatments (RCA, Acetone/IPA rinse) and coatings (fresh/one-day-aged Ti, fresh/one-day-aged Cr, SU-8 2005) on adhesion strength as well as surface uniformity for 100 gm thick SU-8 films. Additionally, we vary the soft bake times and temperatures while keeping all other process parameters constant, to correlate adhesion strength with surface uniformity of SU-8 films for each surface modification.We have found that for all surface treatments/coatings, a soft bake temperature of 65°C for 90 minutes yielded a more uniform SU-8 film (a = 5.18 gm) as compared to the manufacturer-recommended soft bake temperature of 95°C (a = 12.66 gm) for 30 minutes. Consequently, a more uniform SU-8 film provided excellent adhesion strength 2 MPa, as determined by stress testing using an Instron microtester) for both metallic seed layers while the adhesion strength of films baked at 95°C was determined to be < 0.5 MPa. This study, for the first time, has been able to quantitatively determine the adhesion strength of SU-8 films on different seed layers deposited on glass substrates, for varying soft bake temperatures.
机译:我们介绍了表面处理/涂层和软烘烤温度的效果,旨在改善SU-8在玻璃基板上的粘附和表面均匀性。虽然先前已经研究了SU-8对金属层对金属层的粘附强度,但我们的研究审查了额外的表面处理(RCA,丙酮/ IPA冲洗)和涂料的影响(新鲜/单日龄,新鲜/每日老年CR,SU-8 2005)关于粘合强度以及100克厚的SU-8薄膜的表面均匀性。另外,我们改变软烘烤时间和温度,同时保持所有其他工艺参数恒定,以将粘附强度与SU-8薄膜的表面均匀性相关,每个表面改性都发现。我们已经发现,对于所有表面处理/涂层,柔软的烘烤温度与制造商推荐的软烘烤温度为95℃(a = 12.66克),95℃,90分钟90分钟产生更均匀的SU-8薄膜(A = 5.18克)。因此,更均匀的SU-8膜提供优异的粘合强度2MPa,通过使用Instron Microtster来确定金属种子层,而在95℃下烘烤的薄膜的粘合强度被确定为<0.5MPa。这项研究首次能够定量地确定沉积在玻璃基板上的不同种子层上的SU-8膜的粘附强度,用于改变软烘烤温度。

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