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Diffusion Bonding of Tungsten to Reduced Activation Ferritic/Martensitic Steel F82H Using a Titanium Interlayer

机译:钨的扩散键合使用钛中间层减少活化铁素体/马氏体钢F82h

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Development of materials and related fabrication process is one of the most important technologies for fusion energy development. In fusion reactor, joining of tungsten (W) to reduced activation ferritic/martensitic steel is required. In this work, diffusion bonding between W and ferritic/martensitic steel F82H using a Ti interlayer was investigated. The results indicated that all the joints were successfully obtained. The interfacial microstracture was analyzed by scanning electron microscopy. The chemical composition of these reaction products were determined by energy dispersive spectroscopy. W-Ti solid solution was found at W/Ti interface, while Ti/F82H interface formed complex phases which dependent on the joining temperature. Bond strength was evaluated and the maximum shear strength was obtained for the joint bonded at 900°C. The failure was occurred at Ti/F82H interface during shear testing.
机译:材料和相关制造过程的发展是融合能源发展最重要的技术之一。在熔融反应器中,需要加入钨(W)减少活化铁素体/马氏体钢。在这项工作中,研究了使用Ti中间层的W和铁素体/马氏体钢F82h之间的扩散键合。结果表明所有关节都已成功获得。通过扫描电子显微镜分析界面微动术。通过能量分散光谱法测定这些反应产物的化学成分。在W / Ti界面中发现W-Ti固溶体,而Ti / F82H界面形成复杂的相位,其取决于接合温度。评价粘合强度,并获得在900℃下键合的接头获得最大剪切强度。在剪切测试期间在TI / F82H界面发生故障。

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