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Microstructure and mechanical properties of diffusion bonded joints between tungsten and F82H steel using a titanium interlayer

机译:钛中间层在钨与F82H钢之间的扩散焊接接头的组织和力学性能

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摘要

Diffusion bonding between W and ferritic/martensitic steel F82H using a Ti interlayer was carried out in vacuum at temperature range of 850–950 °C for 1 h with 10 MPa. Metallographic analysis with field-emission scanning electron microscopy revealed excellent bonding at both W/Ti and Ti/F82H interfaces. The chemical compositions of the reaction products were analyzed by energy dispersive spectroscopy and their existence were confirmed by X-ray diffraction technique. α–β Ti solid solution was detected at W/Ti interface, while the reaction phases at Ti/F82H interface are dependent on the joining temperature. Joint strength was evaluated and the variations in strength of the joints were significantly related to the microstructural evolution of the diffusion zone. All the joints fractured at Ti/F82H interface during shear testing. The hardness distribution across the joining interfaces was also determined.
机译:使用Ti夹层在W和铁素体/马氏体钢F82H之间进行扩散键合,并在850-950°C的温度范围内,真空度为10 MPa的条件下进行1 h。利用场发射扫描电子显微镜进行的金相分析表明,在W / Ti和Ti / F82H界面均具有出色的键合性能。通过能量色散光谱法分析了反应产物的化学组成,并通过X射线衍射技术证实了它们的存在。在W / Ti界面处检测到α-βTi固溶体,而Ti / F82H界面处的反应相取决于连接温度。对接头强度进行了评估,接头强度的变化与扩散区的微观结构演变显着相关。在剪切测试期间,所有接头在Ti / F82H界面处断裂。还确定了跨接合界面的硬度分布。

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