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Focused Ion Beam as New Tool for Local Investigations of the Interaction of Microcracks with Grain Boundaries

机译:聚焦离子束作为局部调查微裂纹与晶粒边界的互动的新工具

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So far the interaction of microcracks with microstructural elements like grain boundaries or phase boundaries is described qualitatively well by the models of Tanaka and Navarro and De Los Rios. However, an experimentally verified quantitative description is missing due to a lack of systematic experiments. The concept by Marx and Schaef introduced a combination of a focused ion beam technique with high resolution scanning electron microscopy. It is the first method to initiate artificial microcracks with idealized crack parameters relative to selected phase and grain boundaries. This combination of characterizing and manipulating techniques on a micro-scale enables for the first time a systematic investigation of the interaction between short cracks and micro-structural barriers to check the models quantitatively. However, the geometry of the active slip planes in the adjacent grains, their misorientation angle, and the position of the grain boundary is a three-dimensional problem. Therefore the geometry was reconstructed after the crack propagation measurements by focused ion beam tomography to measure the inclination angles between the surface, the crack plane, and the grain boundary. The results should lead to a better understanding of the physical mechanisms of crack propagation through grain and phase boundaries, which is fundamental to explain the huge scatter in the short crack behavior and to develop materials with fatigue resistant grain boundaries.
机译:到目前为止微裂纹与微观结构元素的相互作用,如纹塔卡和纳瓦罗和瓦罗罗和罗西俄里斯的模型描述了晶界或相位边界的微观结构元素。然而,由于缺乏系统实验,缺少实验验证的定量描述。 Marx和Schaef的概念引入了具有高分辨率扫描电子显微镜的聚焦离子束技术的组合。它是第一种用于将人为微裂纹引发了具有相对于所选阶段和晶界的理想化裂缝参数的方法。这种特征和操纵微尺度技术的组合首次使得能够对短裂缝和微结构屏障之间的相互作用进行系统研究,以定量地检查模型。然而,相邻晶粒中的主动滑架的几何形状,它们的错位角度和晶界的位置是三维问题。因此,在通过聚焦离子束断层扫描通过聚焦离子束断层扫描来重建几何形状,以测量表面,裂缝平面和晶界之间的倾斜角度。结果应更好地了解通过晶粒和相界限的裂纹传播的物理机制,这是解释短裂缝行为中巨大散射的基础,并开发具有疲劳抗性晶界的材料。

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