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Hydrogel-Based Actuation for Modiolar Hugging Cochlear Implant Electrode Arrays

机译:基于水凝胶的Modiolar拥抱耳蜗植入电极阵列的驱动

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A flexible and hydrogel-swelling-based actuated electrode array for cochlear implants was developed to bridge the gap between commercially available flexible and easily implantable straight electrode arrays on one side as well as stiff and difficulty implantable pre-curved electrode arrays on the other side. Therefore, the presented array consists of a polyimide/gold thin-film electrode carrier embedded in a silicone rubber shaft with immersed hydrogel particles, which bends itself by contact to intracochlear liquid. To achieve a stable bonding between the silicone rubber and the thin-film electrode, a silica coating was applied on the electrode carrier and an improved bonding strength was achieved. Electrode arrays were tested in a cochlea model and a modiolar hugging was observed in relation to the amount of hydrogel particles.
机译:开发了一种用于耳蜗植入物的柔性和水凝胶膨胀的致动电极阵列,以弥合在一侧的市售柔性且易于植入的直电极阵列之间的间隙以及另一侧的难以造成的预弯曲电极阵列。因此,所提出的阵列由嵌入硅橡胶轴中的聚酰亚胺/金薄膜电极载体组成,该橡胶轴具有浸入水凝胶颗粒,其通过与肠溶液液接触而自身弯曲。为了在硅橡胶和薄膜电极之间实现稳定的粘合,在电极载体上施加二氧化硅涂层,实现了改善的粘合强度。在耳蜗模型中测试电极阵列,并且在与水凝胶颗粒的量相对于水凝胶颗粒的量观察到Modiolar拥抱。

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