首页> 外文会议>International Conference on Micro Electro Mechanical Systems >REALIZING DEEP-SUBMICRON GAP SPACING FOR CMOS-MEMS RESONATORS WITH FREQUENCY TONING CAPABILITY VIA MODULATED BOUNDARY CONDITIONS
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REALIZING DEEP-SUBMICRON GAP SPACING FOR CMOS-MEMS RESONATORS WITH FREQUENCY TONING CAPABILITY VIA MODULATED BOUNDARY CONDITIONS

机译:通过调制边界条件实现CMOS-MEMS谐振器的深亚微米间隙间距,通过调制边界条件

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Integrated CMOS-MEMS array resonators have been demonstrated that takes advantage of pull-in effect to surmount limitations of CMOS foundry process and attains electrode-to-resonator gap spacing at a deep-submicron range, leading to much smaller motional impedance compared to conventional CMOS-MEMS technologies, while possessing unique frequency tuning capability by modulating their mechanical boundary conditions. With the increase of applied dc-bias which simultaneously serves for functions of pull-in and resonator operation, the upward frequency shift of resonance caused by boundary condition ("BC") change offers opposite tuning mechanism to well-known effect of electrical stiffness. As a result, frequency variation induced by BC-modulation and electrical-stiffness would yield a frequency-insensitive region under a certain dc-bias.
机译:已经证明了集成的CMOS-MEMS阵列谐振器,该谐振器利用拉动效应于CMOS铸造工艺的超级限制,并在深亚微米范围内达到电极到谐振器间隙间距,与传统CMOS相比,导致更小的运动阻抗-mems技术,通过调制其机械边界条件来拥有独特的频率调谐能力。随着应用DC - 偏置的升高,同时用于引入和谐振器操作的功能,边界条件(“BC”)变化引起的共振的向上频移提供了相反的调谐机构,以众所周知的电刚度的效果。结果,由BC调制和电刚度引起的频率变化将在某个DC偏压下产生频率不敏感区域。

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