Design of Shorting Vias in Alternative PCB Planes for Suppressing Ground-Bounce Induced Electromagnetic Emission

摘要

The stacked ground planes with vias stitching is employed to suppress the ground-bounce induced electromagnetic emission in multilayer printed circuit boards. This paper developed an analytic normal-mode analysis and used it to design the optimized positions of the vias in the board periphery. Comparison with full-wave simulation validates that the proposed systematic design procedure can easily achieve the desired EMI suppression from dc up to several GHz.