Ultra fine particles with diameter of several to several hundreds of nanometers were adhered onto the Si surface and the removal efficiency of the ultra fine particles using various cleaning solutions was investigated. It has been found that the conventional cleaning methods are unacceptable for removing Au ultra fine particles with diameter of less than several tens of nanometers. In addition, it has also been found that particle removal by chemical etching, such as DHF-H{sub}2O{sub}2, causes increased surface roughness due to local chemical reactions.
展开▼
