首页> 外文会议>Annual Technical Conference of the Society of Plastics Engineers >INNER MELT PEAK PACK TEMPERATURE END PRESSURE SENSOR
【24h】

INNER MELT PEAK PACK TEMPERATURE END PRESSURE SENSOR

机译:内部熔体峰值包装温度末端压力传感器

获取原文

摘要

A thermocouple profiling temperature and inner melt pressure flow from fill to peak pack is presented. The mold close processing cycle varies the melt cavity fill to peak pack volume. Mold close starts the gas venting indicates injection start. The heated melt front flow temperature and low pressure encloses the sensor as melt flow progresses to pack point. The static outer melt skin and final inner melt pack pressure occurs at gate seal. After inner melt packing stops the volume shrink cure starts. The shrink rate is dependant on final peak pack volume and melt temperature peak.
机译:提出了从填充到峰包的热电偶分析温度和内部熔体压力。模具关闭加工循环变化熔体腔填充到峰值包装体积。模具关闭启动气体通风表明注射开始。加热的熔体前流量温度和低压包围传感器,因为熔体流动进入包装点。静态外部熔体皮肤和最终内熔融包装压力发生在栅极密封上。在内部熔化包装停止后,体积收缩固化开始。收缩率取决于最终峰值包装体积和熔融温度峰值。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号