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INNER MELT PEAK PACK TEMPERATURE END PRESSURE SENSOR

机译:内熔峰包温度末端压力传感器

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摘要

A thermocouple profiling temperature and inner melt pressure flow from fill to peak pack is presented. The mold close processing cycle varies the melt cavity fill to peak pack volume. Mold close starts the gas venting indicates injection start. The heated melt front flow temperature and low pressure encloses the sensor as melt flow progresses to pack point. The static outer melt skin and final inner melt pack pressure occurs at gate seal. After inner melt packing stops the volume shrink cure starts. The shrink rate is dependant on final peak pack volume and melt temperature peak.
机译:给出了从填充到峰顶的热电偶分析温度和内部熔体压力流。模具闭合处理周期将熔体腔填充量更改为最大填充量。合模开始时,排气将指示注射开始。当熔体流达到填充点时,加热的熔体前流温度和低压将传感器包围起来。静态外部熔体表层和最终内部熔体充填压力发生在浇口密封处。内部熔体堆积停止后,开始体积收缩固化。收缩率取决于最终峰填充量和熔体温度峰。

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