This is a report on a panel discussion organized in Photomask Japan 2008, where the challenges about "MaskComplexities, Cost, and Cycle Time in 32-nm System LSI Generation" were addressed to have a look over the possiblesolutions from the standpoints of chipmaker, commercial mask shop, DA tool vendor and equipments makers. Thewrap-up is as follows: Mask complexities justify the mask cost, while the acceptable increase rate of 32nm-mask costsignificantly differs between mask suppliers or users side. The efficiency progress by new tools or DFM has driven theircycle-time reductions. Mask complexities and cost will be crucial issues prior to cycle time, and there seems to be linearcorrelation between them. Controlling complexity and cycle time requires developing a mix of advanced technologies,and especially for cost reduction, shot prices in writers and processing rates in inspection tools have been improvedremarkably by tool makers. In addition, activities of consortium in Japan (Mask D2I) are expected to enhance the totaloptimization of mask design, writing and inspection. The cycle-time reduction potentially drives the lowering of maskcost, and, on the other, the pattern complexities and tighter mask specifications get in the way to 32nm generation as wellas the nano-economics and market challenges. There are still many difficult problems in mask manufacturing now, andwe are sure to go ahead to overcome a 32nm hurdle with the advances of technologies and collaborations by not onlytechnologies but also finance.
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