Results from the KLA-Tencor TeraScanXR reticle inspection tool

摘要

The new TeraScanXR reticle inspection system extends the capability of the previous TeraScanHR platform to advanced32nm logic and 40nm Half Pitch (HP) memory technology nodes. The TeraScanXR has been designed to provide asignificant improvement in image quality, defect sensitivity and throughput relative to the HR platform. Defectsensitivity is increased via a combination of improved Die-to-Die (D:D) and Die-to-Database (D:DB) algorithms, as wellas enhancements to the image auto-focus (IAF). Modifications to system optics and the introduction of a more powerfulimage processing computer have enabled a –2X faster inspection mode. In this paper, we describe the key features of theTeraScanXR platform and present preliminary data that illustrate the capability of this tool. TeraScanHR tools currentlyat customer sites are field-upgradeable to the TeraScanXR configuration.