DICING PROCESS FOR THE DEVICE SEPARATION OF A SLIDER WITH AN INTEGRATED MICROACTUATOR (SLIM)

摘要

A Micro Electro-mechanical Systems (MEMS) type Slider with an Integrated Microactuator (SLIM) is capable of moving the read-write element both in vertical direction (adjusting the flying height) and in lateral direction (allowing second stage actuation). Developing this system not only poses substantial challenges in the area of wafer processes, but also in mechanical micromachining for separating the parts. The main challenge is to release a mounting block without breaking the delicate Si leaf springs it is suspended on. This paper describes the process development for separating Si stacks with parts suspended on delicate solid state joints, ultimately intended for being applied to machining the SLIM device. It presents the slicing and dicing experiments conducted and outlines the results.