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RELAXATION OF RESIDUAL STRESSES IN BRUSH-PLATED GOLD COATING

机译:刷涂金涂层中的残余应力放松

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In this study residual stresses were determined in a gold coating deposited from a commercial SIFCO Dalic Solution (Gold (Hard Alloy), Code SPS 5370) on copper and brass substrates with different thicknesses. The calculation formula is extended Stoney's formula which takes into consideration the real shape of the substrate, and the difference between the elasticity moduli and the coefficient of thermal expansion of the coating and the substrate materials. Residual stresses in coatings represent significant tensile stresses and their maximum values are higher than the values of stresses in coatings obtained in a bath solution. The values of residual stresses decrease markedly and after nine months they are many times smaller than after deposition. The sensitivity of the method was studied and the expanded uncertainties of the computed mean values of the residual stresses are presented. Substrate deformation depending on coating thickness is examined.
机译:在该研究中,在具有不同厚度的铜和黄铜基板上沉积在商业SiFco幼型溶液(金(硬合金),代码SPS 5370)的金涂层中确定残余应力。 计算公式是扩展的Stoney的公式,该公式考虑了基板的真实形状,以及弹性模量与涂层的热膨胀系数和基板材料之间的差异。 涂层中的残余应力表示显着的拉伸应力,并且它们的最大值高于在浴溶液中获得的涂层中应力的值。 残余应力的值明显降低,并且在九个月后,它们比沉积之后的次数很多。 研究了该方法的灵敏度,并呈现了残余应力的计算平均值的扩展不确定性。 检查基板变形取决于涂层厚度。

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