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Status and challenges of PCM modeling

机译:PCM建模的状态和挑战

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From the stage of concept-level alternative to Flash memories, the phase-change memory (PCM) is rapidly gaining the status of reference technology for high performance, high endurance next generation non volatile applications. To sustain the development of new and scaled PCM technologies, a comprehensive understanding and modelling of the cell at the material, cell and large-array levels are required. This paper will address the most significant achievements in the electrothermal modelling of PCM single cell. After reviewing the transport modeling in the amorphous and crystalline phases of the chalcogenide material, we focus on the application modeling of the cell, discussing programming current minimization by geometry optimization, trade-off between programming current and readout resistance and the program disturb issue. Scaling of the PCM is extensively addressed, comparing isotropic and non isotropic scaling and the respective impact on cell reliability. The open issues for PCM physical modeling are finally pointed out.
机译:从概念级别替代到闪存的阶段,相变内存(PCM)正在快速获得高性能高,耐久性下一代非易失性应用的参考技术的状态。为了维持新的和缩放的PCM技术的开发,需要在材料,电池和大阵列级别的全面理解和建模。本文将解决PCM单电池电热建模中最重要的成果。在审查硫族化物材料的无定形和结晶阶段中的运输建模后,我们专注于电池的应用建模,讨论通过几何优化,编程电流与读出电阻之间的权衡折衷和程序干扰问题的编程电流最小化。 PCM的缩放广泛寻址,比较各向同性和非各向同性缩放以及对细胞可靠性的各个影响。终于指出了PCM物理建模的开放问题。

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