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Reduction of cutting forces by elliptical vibration in multi-pass ultraprecise single point axial cutting of V-grooves

机译:通过椭圆形振动减少切割力,在V形槽的多通超挑单点轴向切割中

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Elliptical vibration cutting (EVC) is an advanced micromachining technology that has a wide range of applications in high-precision micro/nano manufacturing. This technology is primarily used in fabrication of micro/nano-scale functional surfaces, geometrical features, optical and holographic components that are cut in ferrous and difficult-to-cut tooling materials with high form accuracy and surface quality. The main objective of this study was to demonstrate the positive effect of EVC motions on cutting force reduction and stabilization. For this purpose, a series of cutting trials involving the fabrication of micro V-grooves by means of the ultraprecise single point cutting (USPC) were performed. To maintain a constant level of the cutting force, an axial multi-pass cutting strategy with constant cutting area was employed. The influence and advantages brought by EVC over the conventional 'no-EVC USPC scenario were initially assessed by means of the theoretical considerations of the cutting force. Following that, experimental generation of V-grooves has demonstrated that the integration of EVC kinematics with USPC motions has the ability to reduce the 'no-EVC cutting forces by more than 90%, to values around 0.1 N for the main axial component. The addition of EVC motions caused a minimal decrease in surface quality whose areal roughness increased from 14 nm in the 'no-EVC case to 16 nm in the 'with-EVC scenario. These observations are expected to open new opportunities in micromachining of micro/nano products, systems, sensors, functional surfaces, and lighting and holographic optics.
机译:椭圆振动切割(EVC)是一种先进的微机械技术,具有各种应用在高精度微/纳米制造中。该技术主要用于制造微/纳米级功能表面,几何特征,光学和全息成分,所述几何特征,光学和全息成分,所述金属丝和难以切割的工具材料具有高形式精度和表面质量。本研究的主要目的是证明EVC运动对减少削减和稳定性的积极影响。为此目的,通过超挑单点切割(USPC)进行一系列涉及微V槽的切割试验。为了保持切割力的恒定水平,采用具有恒定切割区域的轴向多通切割策略。 EVC在传统的“No-EVC USPC场景上通过的影响和优势通过切割力的理论考虑来评估。在此之后,V-Groves的实验生成表明,EVC运动学与USPC运动的集成能够将“无-VC切割力超过90%以上,为主要轴向部件约为0.1n。添加EVC运动导致表面质量的最小降低,其面积粗糙度从14nm中的“No-EVC案例”中的14nm增加到16nm的“在IVC场景中”。预计这些观察将在微/纳米产品,系统,传感器,功能表面和照明和全息光学和全息光学中开辟新的机会。

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