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Temperature-Aware Submesh Allocation Scheme for Heat Balancing on Chip-Multiprocessors

机译:用于芯片 - 多处理器的热平衡的温度感知子孔分配方案

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This paper explores the thermal problems in future CMPs in multiprogrammed environment for heat balancing. We first give the observation of the temperature variation of cores in this scenario. Then we propose a temperature-aware submesh allocation scheme to manage cores with submeshes and allocate submeshes of cores to jobs under temperature-aware policies to balance heat chip-wide. Several scheduling policies are suggested and a HotSpot-based thermal simulator is used to evaluate the scheme and its policies under the workloads of benchmark programs. Simulation results show that our proposed scheme with global coolest policy and global neighbor-aware policy can lead to lower peak temperatures and effectively reduce the temporal variance and spatial variance of temperatures of cores to achieve better heat balance.
机译:本文探讨了未来CMP中的热量问题,用于热平衡。我们首先探讨了这种情况下核心的温度变化。然后,我们提出了一种温度感知的子孔分配方案来管理与子表库的内核,并在温度感知策略下将核心子项分配给作业,以平衡热芯片宽。提出了几种调度策略,并使用热点的热模拟器来评估基准程序的工作量下的方案及其策略。仿真结果表明,我们具有全球最酷的政策和全球邻近政策的拟议方案可以导致峰值温度降低,并有效降低核心温度的时间方差和空间方差,以实现更好的热平衡。

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