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EMC simulation of complex PCB inside a metallic enclosure and shielding effectiveness analysis

机译:金属外壳内复杂PCB的EMC仿真与屏蔽效果分析

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In the present paper the Finite Integration Technique (FIT) in combination with the Partial Element Equivalent Circuit (PEEC) is employed to investigate the shielding performance of a metallic enclosure used for digital switching equipment. The current distribution on the power plane of a complex printed circuit board is used to excite the system. The effect of apertures’ shape and configuration on the value of the radiated Electric field is studied. It is shown that dividing a specified area into a combination of multiple apertures may reduce the value of the radiated emissions and therefore improve the shielding effectiveness. The usage of honeycomb panels is finally investigated.
机译:在本文中,采用有限的集成技术(配合)与部分元件等效电路(PEEC)组合用于研究用于数字开关设备的金属外壳的屏蔽性能。复杂印刷电路板电源平面上的电流分布用于激发系统。研究了孔的形状和配置对辐射电场的值的影响。结果表明,将指定区域划分为多个孔的组合可以降低辐射发射的值,从而提高屏蔽效果。终于调查了蜂窝面板的使用。

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