Effect of Powder Contents on Stress Relaxation of Glass Powder Reinforced Epoxy

摘要

Glass powder reinforced epoxy was used in the fields of plastic sealing of semiconductor devices. In such environment, the materials were exposed in the high temperature, and the stress relaxation behavior must occur in the materials. Therefore, the analysis of stress relaxation behavior was needed. The stress relaxation behaviors of epoxy composites filled with different amounts of glass powder were investigated. Master curves of stress relaxation were obtained, and timetemperature superposition principle was observed on perpetrated epoxy composites. The slopes of time-temperature shift factors were changed depended on the amount of glass powder. It is therefore, we can calculate the timetemperature shift factors by using this relationship. The effect of amounts of glass powder on stress relaxation was investigated, too. Comparing the master curves of stress relaxation with the different amount of glass powder, it is understood that the stress relaxation behaviors of both materials are the same. And it is explained that the effect of glass powder contents on stress relaxation behavior is the effect of reinforcement and heat resistance.