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The Calorimetric Glass Transition for Single Polystyrene Ultrathin Films using Flash DSC

机译:使用闪光DSC的单聚苯乙烯超薄膜的量热玻璃过渡

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The calorimetric glass transition (T_g) is measured for single polystyrene ultrathin films, 160 and 71 nm thick, using Flash Differential Scanning Calorimeter (DSC) as a function of cooling rate and film thickness. The glass transition temperature of 160 nm-thick film is consistent with the bulk data from conventional DSC. For 71 nm-thick film with grease between the film and the sensor, the T_g depression decreases with increasing cooling rate and its magnitude is similar to those for solid-supported films in the literature. The evolution of the T_g depression was investigated during annealing at 160°C, and we find that the depressed T_g value reverts to the bulk value within 20 hours due to hole growth and film thickening. On the other hand, for 71 nm-thick films directly spuncast on the sensor, no T_g depression is observed. The results show the importance of film preparation, interface, and annealing on the T_g depression of ultrathin films.
机译:使用快速差示扫描量热计(DSC)作为冷却速率和膜厚度的函数,测量热量玻璃过渡(T_G)的单聚苯乙烯超薄膜,160和71nm厚。 160nm厚膜的玻璃化转变温度与来自常规DSC的散装数据一致。对于薄膜和传感器之间的润滑脂的71nm厚的膜,T_G凹陷随着冷却速率的增加而降低,其幅度类似于文献中固体支持的薄膜。在160℃的退火过程中研究了T_G凹陷的演变,并且我们发现凹陷的T_G值由于孔生长和薄膜增厚而在20小时内恢复到体重。另一方面,对于71个NM厚的薄膜在传感器上直接SPINCAST,没有观察到T_G凹陷。结果表明薄膜制备,界面和退火对超薄薄膜的T_G凹陷的重要性。

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