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Determining Confounding Sensitivities in Eddy Current Thin Film Measurements

机译:确定涡流薄膜测量中的混淆敏感性

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Eddy current (EC) techniques are widely used in industry to measure the thickness of non-conductive films on a metal substrate. This is done by using a system whereby a coil carrying a high-frequency alternating current is used to create an alternating magnetic field at the surface of the instrument's probe. When the probe is brought near a conductive surface, the alternating magnetic field will induce ECs in the conductor. The substrate characteristics and the distance of the probe from the substrate (the coating thickness) affect the magnitude of the ECs. The induced currents load the probe coil affecting the terminal impedance of the coil. The measured probe impedance is related to the lift off between coil and conductor as well as conductivity of the test sample. For a known conductivity sample, the probe impedance can be converted into an equivalent film thickness value. The EC measurement can be confounded by a number of measurement parameters. It was the goal of this research to determine which physical properties of the measurement set-up and sample can adversely affect the thickness measurement. The eddy-current testing was performed using a commercially available, hand-held eddy-current probe (ETA3.3H spring-loaded eddy probe running at 8 MHz) that comes with a stand to hold the probe. The stand holds the probe and adjusts the probe on the z-axis to help position the probe in the correct area as well as make precise measurements. The signal from the probe was sent to a hand-held readout, where the results are recorded directly in terms of liftoff or film thickness. Understanding the effect of certain factors on the measurements of film thickness, will help to evaluate how accurate the ETA3.3H spring-loaded eddy probe was at measuring film thickness under varying experimental conditions. This research studied the effects of a number of factors such as i) conductivity, ii) edge effect, iii) surface finish of base material and iv) cable condition.
机译:涡流(EC)技术广泛用于工业中,以测量金属基板上的非导电膜的厚度。这是通过使用一种系统来完成的,由此用于携带高频交流电的线圈用于在仪器探针的表面处产生交替的磁场。当探针带接近导电表面时,交变磁场将诱导导体中的EC。基板特性和探针与基板的距离(涂层厚度)影响ECS的大小。感应电流加载影响线圈的端子阻抗的探针线圈。测量的探针阻抗与线圈和导体之间的升力以及测试样品的电导率有关。对于已知的电导率样品,可以将探针阻抗转换成等效膜厚度值。 EC测量可以混淆多个测量参数。该研究的目标是确定测量设置和样品的物理性质可能对厚度测量产生不利影响。使用商业上可用的手持式涡流探头(ETA3.3H弹簧加载的涡流探针在8 MHz上运行)进行涡流测试,该探头具有支架以保持探头。支架保持探头并调节Z轴上的探头,以帮助将探针定位在正确的区域中以及精确测量。来自探针的信号被送到手持读数,其中结果直接记录在升降机或膜厚度方面。了解某些因素对薄膜厚度测量的影响,有助于评估ETA3.3H弹簧加载涡流探针在不同的实验条件下测量膜厚度的准确性。该研究研究了诸如i)电导率,ii)边缘效应,iii)表面光洁度的效果,基材和IV)电缆条件。

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