COMPARISON OF FILL FACTOR LOSS MECHANISMS FROM PRINT QUALITY AND ELECTRICAL PARAMETERS IN THE MOVE TOWARDS HIGHER SHEET RESISTANCE EMITTERS

摘要

As a supplier of contact metallization pastes for crystalline silicon solar cells, Heraeus works with cell manufacturers to improve fill factors and mitigate losses associated to lower emitter dopant levels. Here we use a computer model to segregate the influences from multiple variables on fill factor and shading related losses. The goal is that by separating the influence of these factors we can better understand each of them individually. The model confirms that front contact pastes capable of delivering lower contact resistance, higher aspect ratios, and better printed cross sections (or paste slump) will be critical to driving towards higher fill factors and efficiencies.