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Metrology at the Leading Edge

机译:前沿的计量

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摘要

The challenges facing characterization and metrology of future semiconductor technology is described in the 2005 ITRS Metrology Roadmap[1]. These challenges are driven by the technologies for future device structures that include molecular electronics, spintronics, nanotube and nanowire based electronics, and other futuristic concepts. Although the challenges are separated into the pre and post 32nm 1/2 pitch nodes, these challenges represent the issues facing the extension of CMOS for another 15 years. Additional challenges are described in a section covering measurement needs for technology beyond CMOS. In this presentation, a brief overview of measurement issues will be described for both CMOS extension and beyond CMOS electronics.
机译:2005年ITRS Metrology RoadMap [1]中描述了未来半导体技术表征和计量的面临挑战。这些挑战是由未来设备结构的技术驱动,该技术包括分子电子,熔点,纳米管和基于纳米线的电子产品和其他未来派概念。虽然挑战分为前后和32nm 1/2节点节点,但这些挑战代表了15年来面临CMOS延伸的问题。在涵盖超出CMOS的技术的额外测量需求的部分中描述了额外的挑战。在本介绍中,将对CMOS扩展及超越CMOS电子设备来描述测量问题的简要概述。

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