Effect of Substrate Grain Size and Orientation on the Transient Liquid-Phase Bonding of Ferritic Oxide Dispersion Strengthened Alloys

摘要

This paper reports the microstructural features of transient liquid phase (TLP) bonding of two mechanically alloyed (MA) ferritic oxide dispersion strengthened (ODS) alloys, MA956 and PM2000. The influence of the substrate faying surface orientation with respect to the extrusion direction on the bond microstructural development is investigated. Physical vapor deposited boron thin films were used as interlayers for bonding. Post bond heat treatment (PBHT) was performed to induce recrystallization across the bondline. Better microstructural continuity occurred when the substrates were used in the unrecrystallized fine grain condition, with the faying surface aligned in the working direction, as compared to the substrates aligned in the direction normal to the working direction.