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DEPOSITION AND CHARACTERIZATION OF DIAMOND PROTECTIVE COATINGS ON WC-CO CUTTING TOOLS

机译:WC-CO切割工具中金刚石保护涂层的沉积和表征

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Diamond coatings were deposited on WC-Co cutting inserts by microwave plasma enhanced chemical vapour deposition. To restrict the catalytic effect of cobalt binder phase for graphite formation, a combination of hydrochloric acid etching and H_2 plasma treatment was used as substrate pretreatment to reduce surface Co concentration and modify substrate surface morphology. SEM results show that continuous nanocrystalline diamond coatings were formed on pretreated substrates, whereas a composite of diamond and graphite was formed on untreated substrates. Raman spectra show strong diamond characteristic peak at about 1332cm"1 on pretreated substrates, while only strong graphite peaks and weak diamond peak are on untreated substrates. No film spallation was observed along the scratching track in scratching tests of the diamond coatings on pretreated substrates. Among the three tested pretreatments (HCl+H_2, H_2+HCl, HCl), H_2+HCl, hydrogen plasma etching followed with hydrochloride etching produces the highest diamond phase content.
机译:通过微波等离子体增强化学气相沉积在WC-CO切削刀片上沉积金刚石涂层。为了限制石墨形成钴粘合剂相的催化作用,盐酸蚀刻和H_2等离子体处理的组合用作底物预处理,以减少表面Co浓度和改性底物表面形态。 SEM结果表明,在预处理的基材上形成连续的纳米晶金刚石涂层,而在未处理的基材上形成金刚石和石墨的复合物。拉曼光谱在预处理基板上显示约1332cm“1的强菱形特性峰,而在未处理的基材上只有强石墨峰和弱金刚石峰值。在预处理基板上的金刚石涂层的刮擦轨道上没有观察到薄膜剥落。在三种测试的预处理中(HCl + H_2,H_2 + HCl,HCl),H_2 + HCl,氢蚀刻液相蚀刻,产生最高的金刚石相含量。

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