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Yield challenges in nanotechnology

机译:纳米技术产生挑战

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摘要

Summary form only given. As semiconductors enter into the era of nanotechnology, fast yield ramp becomes a critical success factor for 300-mm manufacturing, enabling quick product time to market. Hence, the implementation of enhanced yield improvement techniques is essential to meet the yield challenge. This presentation covers the state-of-the-art automation, advanced integrated yield systems, in-line process control, metrology and inspection/electrical testing and enhanced physical and failure analysis techniques for Chartered Fab 7, 300-mm nanotechnology Fab. It also demonstrates the combination of intelligent automation and advanced integrated yield system capability for providing real time, fast and accurate feedback to drive yield improvement and yield prediction.
机译:摘要表格仅给出。随着半导体进入纳米技术的时代,快速屈服斜坡成为300毫米制造的关键成功因子,使产品快速到市场。因此,实施增强的产量改善技术对于满足产量挑战至关重要。本演示文稿涵盖了最先进的自动化,先进的集成产量系统,在线过程控制,计量控制,计量和检测/电气测试,以及用于特许FAB 7,300mm纳米技术Fab的增强的物理和故障分析技术。它还展示了智能自动化和先进的集成屈服系统能力的组合,用于提供实时,快速准确的反馈,以推动产量提高和产量预测。

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