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INTERFACE CRACK GROWTH BY VOID EXPANSION MECHANISMS BETWEEN DUCTILE SOLID AND ELASTIC SUBSTRATE

机译:延性固体和弹性基板之间的空隙膨胀机制裂纹增长

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摘要

Crack growth along an interface between an elastic-plastic solid and an elastic substrate is analysed numerically by using a special cohesive zone formulation, in which the modified Gurson model is applied to describe ductile failure. Small scale yielding conditions are applied with mixed mode loading prescribed on the outer edge of the region analysed.
机译:通过使用特殊的粘性区配方数量分析沿着弹性塑料固体和弹性基板之间的界面的裂纹生长,其中修饰的Gurson模型用于描述延性衰竭。小规模产生条件施加在分析区域的外边缘上规定的混合模式载荷。

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