There has been significant interest in the micromaching of miniature microphones recently. The advantages of micromaching over conventional fabrication include precise dimensional control, the integration of on-chip circuits and potential low cost owing to batch fabrication. These micromaching miniature microphones may be fabricated by two wafers processes with wafer bonding or by single wafer processes with electroplating backplate. Although the micro-electro-mechanical-system technology can be used to fabricate the membranes and backplates for the condenser type capacitive microphone applications, there still exist many issues for mass-product applications, such as dicing and package processes resulting in the destroy the structure of capacitive microphones. The aim of this work is to develop an assembly condenser microphone using silicon microfabrication batch processing combined with the self-aligning technique. Using this technique, the capacitive microphones can be easily obtained without losing the product yield.
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