Heat sink silica effect: A new approach using ANSYS program simulation in Thermal Stereolithography (TSTL) process

摘要

This paper introduces the concept of combining both form (CAD models) and behavior (simulation models) integrated on Stereolithography system. By connecting these tools, designers can create both a system level design description and a virtual prototype of the system. This virtual prototype, in turn, can provide immediate feedback about design decisions by evaluating whether the functional requirements are met in simulation. A finite element model in ANSYS program has been used for the simulation of the curing process during Thermal Stereolithography (TSTL) process. The model takes into account both the thermal and silica the heat sink phenomena involved in the process. Thermal Stereolithography is a manufacturing technique which uses a CO_2 laser beam to cure (solidify) thermoset resin in a selective way to produce three dimensional parts. This technique was initially developed at the State University of Campinas at Brazil. The materials employed are epoxy resin, diethylenetriamine as curing agent and silica powder. The physical process associated to this technology includes heat sink and localized curing of silica powder. In this analysis, the temperature distribution at each point of materials heated by a laser irradiation, and the thermal properties of thermoset resin are investigated. The results are in agreement with the experimental previous. The ANSYS program used in this work could also be integrated in the strategy to virtual prototyping, where the CAD models can be simulated directly trough this interface program.