首页> 外文会议>Society of Plastics Engineers Annual Technical Conference >DEVELOPMENT OF A STIFF, VOID FREE, LOW DENISTY PLASTIC WOOD REPLACEMENT
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DEVELOPMENT OF A STIFF, VOID FREE, LOW DENISTY PLASTIC WOOD REPLACEMENT

机译:开发僵硬,无效,低密度塑料木材更换

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Process studies attempting to produce a low density, wood like replacement involving Kenaf, Polypropylene and hollow glass spheres ("bubbles") blends along with processing aids and compatibilizers have been investigated using a counter-rotating non-intermeshing (CRNI) twin screw extruder. Bubble breakage was higher than anticipated based on related work, but in spite of the fairly low bubble survival rates, nailability of the boards was improved. Bubble breakage and mechanical properties are presented along with a discussion of the narrow process window.
机译:试图产生低密度,木材的替代性涉及keanaf,聚丙烯和中空玻璃球体(“气泡”)和加工助剂和增容剂的替代物的替代物的替代性的研究已经采用了反向旋转的不啮合(CRNI)双螺杆挤出机进行了研究。基于相关工作,泡泡破损高于预期,但尽管气泡存活率相当低,但电路板的不良性得到改善。随着窄处理窗口的讨论,提出了泡泡破损和机械性能。

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