AN EXAMINATION OF AN ADHESIVE BONDING PORTFOLIO TO SATISFY THE NEED FOR OUT-OFAUTOCLAVE COST REDUCTION INITIATIVES FOR AEROSPACE STRUCTURAL BONDING

摘要

The need for materials that have superior structural bonding performance for aerospace assemblies that cure at low temperature and short process times have not been satisfied by current industry product portfolios. This work examines current state-of-the-art approaches to satisfy the need for cost reduction with processes that provide equivalent mechanical performance to those cured in classical autoclave conditions. Film adhesives curing at uncharacteristically low temperatures, low pressure bonding and state-of-the-art development efforts have been examined.