Realizing Low Cost and High Reliability in CSP Packages with Surface Treatment and Material Technology Plasma Treatment Technology

摘要

CSP packages are key devices that are expanding recently in the semiconductor industry. In many cases, CSP packages production has been done because of its low cost and proven results. In this case, the wire bonding electrode and solder ball attach electrode are made by the same plating process. Fig. 1 shows the relationship between the bonding strength and the thickness of plating. As wire bonding electrodes become thinner, there is degradation bonding quality because the Ni compounds migrate toward Au plating surface when subjected to the heat processes. Therefore, to insure good wire bonding quality, we usually have to use thick Au plating.