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SMALL-SCALE MICRO/NANO-MANIPULATORS IN PRECISION ALIGNMENT AND POSITIONING

机译:小型微/纳米操纵器精密对准和定位

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Micro-electro-mechanical systems (MEMS) are small-scale machines which are generally a few millimeters to a few microns in size. They are of interest to precision engineers because of their favorable dynamic characteristics (potential for tens to 100s of kHz bandwidth), favorable thermal characteristics (small size and high thermal diffusivity materials can be used to limit thermal strain errors) and potential for low cost and small packaging that follow when machines are miniaturized. Although the technology required to make simple MEMS devices has existed for several decades; the rate at which the technology has developed solutions for small-scale, precision machines has been slow. This is due in part to the challenges that the small-scale machine designer faces: (1) Design using materials with non-isotropic material properties and which experience non-isotropic material removal rates in MEMS fabrication processes, (2) Many MEMS process rely on chemical processes with rates that may form micron-sized parts, yet the reproducibility of critical feature size and location dimensions is difficult as the sources of variation in micro-fabrication processes are chemical/diffusion-based in nature and not as easily controlled, (3) The design and integration of actuators, sensors and electronics is complicated due to the need to ensure process compatibility between the types of devices which are fabricated on the same wafer, (4) Lack of reliable, low cost metrology equipment for characterizing the multi-axis performance and stiffness of MEMS devices (although interferometer-based systems have started to appear in recent years) and (5) difficulty fabricating robust precision contact bearings and motion constraints in MEMS devices.
机译:微电机械系统(MEMS)是小型机器,通常是几毫米至几微米的尺寸。它们感兴趣的是精密工程师,因为它们有利的动态特性(kHz带宽的潜力为1000次),良好的热特性(小尺寸和高热扩散材料可用于限制热应变误差)和低成本的潜力当机器小型化时,遵循的小包装。虽然在数十年中存在制作简单MEMS器件所需的技术;该技术开发了针对小型精密机器解决方案的速率。这部分是由于小型机器设计者面临的挑战:(1)使用具有非各向同性材料的材料设计,并且在MEMS制造过程中经历非各向同性的材料去除率,(2)许多MEMS过程依赖于在具有可以形成微米尺寸部分的速率的速率的化学过程中,关键特征尺寸和位置尺寸的再现性难以作为微制造工艺的变化来源是基于化学/扩散的基础,而不是容易地控制,( 3)执行器,传感器和电子产品的设计和集成是由于需要确保在同一晶片上制造的设备类型之间的过程兼容性,(4)缺乏可靠,低成本的计量设备,用于表征多个MEMS器件的性能和刚度(尽管基于干涉仪的系统近年来已经开始出现)和(5)难以制造鲁棒精度MEMS设备中的触点轴承和运动约束。

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