NEW COMPOSITE WICK HEAT PIPE FOR COOLING PERSONAL COMPUTERS

摘要

Heat pipe is a two-phase heat transfer device, having excellent heat transfer capability and higher efficiency. It has several advantages compared with other cooling devices such as cooling fans, thermoelectric coolers, liquid pump loop device are that it has simple structures, no moving parts, no power consumption, easy to install and maintenance free. However, with the ever-increasing processor power and heat flux, it is a must to improve heat pipe performance that having lower thermal resistance and larger maximum heat transfer rate. We have developed the composite wick structure heat pipe, which has lower thermal resistance and larger heat transfer rate than the traditional wick structure heat pipe. This paper describes the comparison between composite wick heat pipe and traditional wick heat pipe for cooling personal computers.