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Study of a CdTe high-energy radiation imaging device fabrication by excimer laser processing

机译:基准激光加工CdTe高能辐射成像装置制造的研究

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CdTe based high-energy radiation imaging devices with high-energy resolution with room temperature operation, were fabricated by excimer laser low-temperature processing. A time-resolved reflectivity (TRR) in-situ measurement was carried out for CdTe transitions in order to identify clearly the laser-induced melting threshold of CdTe semiconductor. The threshold was estimated to be about a pulse energy of 50mJ/cm2. The CdTe M--n diode structures were prepared by excimer laser processing and the diode showed good diode I-V characteristics. The reverse current was very low less then 1nA at -100 V as an operation bias, and the CdTe detectors showed good and uniform spectra measurement characteristics. They were integrated with ASIC chips for signal processing as an imaging device unit. The imaging device unit could capture energy resolution of gamma-ray images distinguished by radiation photon energy. The all pixel has within 4.4 keV of FWHM at 122 keV from a Co-57 radioisotope source at room-temperature operation. The intensities of the peak were also very uniform in the device.
机译:CDTE基高能辐射成像装置具有高能分辨率,采用室温操作,采用准分子激光低温处理制造。对CDTE过渡进行了时间分辨反射率(TRR)原位测量,以便清楚地识别CDTE半导体的激光诱导的熔化阈值。估计阈值是约50mJ / cm2的脉冲能量。通过准确的激光加工制备CDTE M-N二极管结构,二极管显示出良好的二极管I-V特性。反向电流在-100V的1NA中非常低,作为操作偏压,并且CDTE检测器显示出良好且均匀的光谱测量特性。它们与ASIC芯片集成为信号处理作为成像装置单元。成像装置单元可以捕获由辐射光子能量的伽马射线图像的能量分辨率。所有像素在室温操作下的CO-57放射性同位素源122keV的42keV内有4.4keV。峰的强度在装置中也非常均匀。

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