VLSI; wireless LAN; mixed analogue-digital integrated circuits; radiofrequency amplifiers; radiofrequency integrated circuits; packaging; system-on-chip; on-chip versus off-chip passives analysis; radio system-on-package design; mixed-signal system-on-package design; VLSI; packaging technologies; system level integration; chip-package constraints; systematic design; RF SoP; RF SoC; design implementation; performance estimation; cost estimation; design techniques; common emitter low noise amplifier; wireless LAN; analytical equations; noise figure; transducer gain; lossy package; 5 GHz;
机译:无线电和混合信号系统级封装设计中的成本和性能折衷分析
机译:具有片上温度传感器和片外传感器接口的多频无源感应标签,采用EPC HF和UHF RFID技术
机译:数字互连的速度和能量分析:片上,片外和自由空间技术的比较
机译:无线电和混合信号系统级封装设计中的片上与片外无源分析
机译:使用基于系统级封装(SOP)的有机技术为无线应用设计和实现高Q无源设备。
机译:化学粗糙化溅射的Au膜用于片上和片内高频超级电容器的痕量锰氧化物
机译:低成本无源射频识别标签的设计与分析