Chip-package co-design for high performance and reliability off-chip communications

摘要

Low interaction between chip and package has more and more limited system performance. In this paper, chip-package co-design methodology is presented. We address high performance and reliability enhancement for off-chip communications under package and interconnection constraints by using impedance control, optimal package pins assignment and transmitter equalization. From the high-speed transmitter design example, it is shown that the system-level performances such as signal integrity, bandwidth, and reliability are significantly improved through this co-design methodology.