Image analysis and data processing of time series fringe pattern of PCBs by using moire interferometry

摘要

This paper discusses the image analysis and data processing for thermal deformation measurement of PCBs. A specially designed test bench was employed successfully to measure the deformation of PCB using moire interferometry. The discussions on optical methods, experimental procedure and image data processing is presented. Fourier-based and wavelet-based approaches are discussed for potential automatic processing. All image and data analysis were finished by MATLAB.