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THE ANALYSIS OF HEAT AND MASS TRANSFER FOR THE POROUS WICK IN THE CPL EVAPORATOR

机译:CPL蒸发器中多孔芯的热量和传质分析

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A capillary pumped loop (CPL), because of its high power thermal transport character, is a system for the thermal discharge of electronic chips with high power loads, especially on the spacecrafts. With a working fluid having relatively larger heat of evaporation, methanol for example, it may transfer significant heat flux. As the evaporator in such a system is the most important part, the optimal design of CPL requires a thorough understanding of physical phenomena in evaporator. In this paper a mathematic model is constructed, in which the most important character is the treatment for the unsaturated region of porous wick in evaporator. Numerical simulation of heat and mass transfer in the porous wick of evaporator is carried out with a new way of modeling.
机译:由于其高功率热传输特性,毛细管泵送环(CPL)是一种具有高功率负载的电子芯片的热排放系统,特别是在航天器上。通过具有相对较大蒸发热的工作流体,例如,它可以传递显着的热通量。随着在这种系统中的蒸发器是最重要的部分,CPL的最佳设计需要彻底了解蒸发器中的物理现象。在本文中,构建了一种数学模型,其中最重要的特征是蒸发器中的多孔芯的不饱和区域的处理。蒸发器多孔芯中热量和质量传递的数值模拟以一种新的建模方式进行。

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