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THE ANALYSIS OF HEAT AND MASS TRANSFER FOR THE POROUS WICK IN THE CPL EVAPORATOR

机译:CPL蒸发器中多孔芯的传热传质分析

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A capillary pumped loop (CPL), because of its high power thermal transport character, is a system for the thermal discharge of electronic chips with high power loads, especially on the spacecrafts. With a working fluid having relatively larger heat of evaporation, methanol for example, it may transfer significant heat flux. As the evaporator in such a system is the most important part, the optimal design of CPL requires a thorough understanding of physical phenomena in evaporator. In this paper a mathematic model is constructed, in which the most important character is the treatment for the unsaturated region of porous wick in evaporator. Numerical simulation of heat and mass transfer in the porous wick of evaporator is carried out with a new way of modeling.
机译:毛细泵送环路(CPL)由于具有高功率热传输特性,是一种用于对高功率负载的电子芯片(尤其是在航天器上)进行热放电的系统。对于具有相对较大的蒸发热的工作流体,例如甲醇,它可能传递大量的热通量。由于这种系统中的蒸发器是最重要的部分,因此CPL的最佳设计需要对蒸发器中的物理现象有透彻的了解。本文建立了一个数学模型,其中最重要的特征是处理蒸发器中多孔芯的不饱和区域。利用一种新的建模方法对蒸发器多孔芯中传热和传质进行了数值模拟。

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