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Electrical Design and Characterization of Differential Pairs of Low Cost PBGA Package for 10 Gbps Applications

机译:10 Gbps应用的低成本PBGA包装的电气设计与表征

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This paper describes comprehensive electrical design and characterization of differential pairs in low cost high frequency/speed electronic packages. A general methodology has been applied to differential pair design and characterization of several PBGA packages developed for 10 Gbps applications. The generalized mixed-mode S-parameter theory used in the characterization is presented along with a comparison of the broadband simulated models and the extracted empirical circuit models. These models are used in the transient analysis to show the performance improvement of differential signaling over single-ended signaling. A device level measument shows the validation of the design and characterization.
机译:本文介绍了低成本高频/速度电子封装的综合电气设计和差分对的表征。一般方法应用于差异对设计和表征几个PBGA封装,为10 Gbps应用开发。在表征中使用的广义混合模式S参数理论与宽带模拟模型和提取的经验电路模型的比较一起呈现。这些模型用于瞬态分析以显示单端信令上差分信令的性能改进。设备级别测量显示器显示了设计和表征的验证。

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