Active thermal control techniques make it feasible to regulate the steady state and transient thermal-mechanical stress in power electronic modules for applications such as motor drives. On-line junction temperature estimation and manipulation of the switching frequency and current limit to regulate the losses, are used to prevent over-temperature and power cycling failures in IGBT power modules. The techniques developed in this work are used to actively control the junction temperature of the power module. This control strategy improves power module reliability and increases utilization of the silicon thermal capacity by providing sustained operation at maximum attainable performance limits.
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