Ultra-high Density Packaging by Component Integration

摘要

The coming generations of portable products require significant improvement of packaging technologies, mainly due to increasing signal frequencies and the demand for higher density of functions. State of the art are organic substrates with high-density build-up layers and micro-vias, equipped on both sides with discrete passive and active components. The space requirement of active chips can be already reduced to a minimum by implementing CSP's (chip size packages) or flip chips. A further miniaturization however requires a 3-dimensional integration of components. Besides miniaturization the new applications require signal frequencies of several GHz. In order to maintain signal integrity, much shorter and impedance-matched interconnects between chips and other components are required. Here a new approach will be described which allows extreme dense 3-dimensinal integration and very short interconnects combined with the generation of integrated resistors. This approach, called "Chip in Polymer" is based on the integration of extremely thin components into build-up layers of printed circuit boards.